Module and electronic apparatus

ABSTRACT

A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation application of U.S. application Ser. No.13/478,850, filed May 23, 2012, which claims priority to Japanese PatentApplication No. 2011-122792, filed May 31, 2011, both of which areexpressly incorporated by reference herein in their entireties.

BACKGROUND

1. Technical Field

The present invention relates to a module and an electronic apparatus.

2. Related Art

For example, a posture angle detecting device provided with a gyrosensor as a sensor that detects a posture of an object or the like isdisclosed (for example, refer to JP-A-11-211481). The posture angledetecting device disclosed in JP-A-11-211481 is configured by disposingthree vibrators (gyro sensors) on a flexible substrate, and by bendingthe flexible substrate in a manner such that detection axes of the threevibrators are orthogonal to each other. In this manner, an angularvelocity around the respective three axes that are orthogonal to eachother may be detected.

However, in the posture angle detecting device, since the respectivevibrators are disposed on the flexible substrate that is soft and hasflexibility, there are the following problems. (1) The mounting of thevibrators is difficult, (2) it is difficult to make the vibrators have adesired posture, specifically, it is difficult to set detection axes ofthe vibrators in a state to be orthogonal to each other and to maintainthis state, and the like.

SUMMARY

An advantage of some aspects of the invention is to provide a module inwhich the mounting of a sensor device is simple, and the sensor devicemay be set in a desired posture, and an electronic apparatus.

An aspect of the invention is directed to a module including: a firstsubstrate that includes an analog circuit; a second substrate thatincludes a digital circuit; a third substrate that includes a firstsensor device; a first connecting portion that connects the firstsubstrate and the second substrate so as to electrically connect theanalog circuit and the digital circuit, and that has flexibility; and asecond connecting portion that connects the first substrate and thethird substrate so as to electrically connect the analog circuit and thefirst sensor device, and that has flexibility.

According to this configuration, a module in which the mounting of asensor device is simple and the sensor device may be set in a desiredposture may be obtained. Specifically, by bend-deforming the secondconnecting portion, the posture of the sensor device with respect to thefirst substrate may be simply changed, and therefore the posture of thesensor device may be constantly maintained in a simple manner.

It is preferred that the module according to the aspect of the inventionfurther includes: a fourth substrate that includes a second sensordevice; and a third connecting portion that connects the first substrateand the fourth substrate, or the third substrate and the fourthsubstrate so as to electrically connect the analog circuit and thesecond sensor device, wherein the third connecting portion may haveflexibility.

According to this configuration, the posture of the first sensor deviceand the second sensor device may be independently changed.

In the module according to the aspect of the invention, it is preferredthat the first substrate further includes a third sensor device that iselectrically connected to the analog circuit.

According to this configuration, the posture of the first sensor device,the second sensor device and the third sensor device may beindependently changed.

In the module according to the aspect of the invention, it is preferredthat the first substrate, the third substrate, and the fourth substrateare disposed to be orthogonal to each other.

According to this configuration, the first sensor device, the secondsensor device, and the third sensor device may be set in a posture to beorthogonal to each other.

In the module according to the aspect of the invention, it is preferredthat each of the first sensor device, the second sensor device, and thethird sensor device is an acceleration sensor or an angular velocitysensor.

According to this configuration, an angular velocity or acceleration maybe detected.

In the module according to the aspect of the invention, it is preferredthat detection axes of the first sensor device, the second sensordevice, and the third sensor device are orthogonal to each other.

According to this configuration, an angular velocity around therespective three axes that are orthogonal to each other may be detected.

In the module according to the aspect of the invention, it is preferredthat the first substrate and the second substrate are opposite to eachother.

According to this configuration, occurrence of noise may be suppressedin a relatively effective manner.

In the module according to the aspect of the invention, it is preferredthat the third sensor device is positioned on a face that is opposite tothe first substrate and the second substrate.

According to this configuration, an adverse effect of the noise from thedigital circuit on the third sensor device may be suppressed.

It is preferred that the module according to the aspect of the inventionfurther includes: a fifth substrate that includes a connector for aninterface; and a fourth connecting portion that connects the secondsubstrate and the fifth substrate so as to electrically connect thedigital circuit and the connector.

According to this configuration, an input and an output of a signal maybe easy.

In the module according to the aspect of the invention, it is preferredthat at least one of the first substrate and the second substrate has acut-out portion, and the connecting portion extends from the cut-outportion.

According to this configuration, the respective connection portions maybe easily bending-deformed.

In the module according to the aspect of the invention, it is preferredthat the analog circuit includes at least one of a power supply circuit,an amplifying circuit, and an analog/digital converting circuit, and thedigital circuit includes a microcontroller.

According to this configuration, a signal detected by the sensor devicesmay be output in a simple and accurate manner.

It is preferred that the module according to the aspect of the inventionfurther includes a supporting member that has a plurality of fixingfaces, wherein the first substrate, the second substrate, and the thirdsubstrate are disposed along the fixing faces, respectively.

According to this configuration, the posture of the sensor devices maybe maintained in a simple manner.

Another aspect of the invention is directed to an electronic apparatusincluding the module according to the above-described aspect of theinvention.

According to this configuration, an electronic apparatus excellent inreliability may be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIGS. 1A and 1B are perspective views illustrating a first embodiment ofa module according to the invention.

FIGS. 2A and 2B are development views of a circuit board provided in themodule shown in FIGS. 1A and 1B.

FIG. 3 is a perspective view illustrating a state in which the circuitboard shown in FIGS. 2A and 2B is assembled.

FIG. 4 is a plan view illustrating an example of an angular velocitysensor provided in the module shown in FIGS. 1A and 1B.

FIGS. 5A and 5B are perspective views illustrating a supporting memberprovided in the module shown in FIGS. 1A and 1B.

FIG. 6 is a transverse cross-sectional view illustrating the supportingmember to which the circuit board is fixed.

FIGS. 7A and 7B are perspective views illustrating the supporting memberto which the circuit board is fixed.

FIG. 8 is a perspective view illustrating a base provided in the moduleshown in FIGS. 1A and 1B.

FIGS. 9A and 9B are plan views illustrating the supporting member shownin FIGS. 5A and 5B and the base shown in FIG. 8.

FIG. 10 is a plan view illustrating a mounting substrate provided in amodule according to a second embodiment of the invention.

FIG. 11 is a view illustrating an example of a configuration of anelectronic apparatus in which a module of the invention is mounted.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, a module and an electronic apparatus of the invention willbe described in detail with reference to preferred embodiments shown inthe attached drawings.

1. Module First Embodiment

First, a first embodiment of a module of the invention will bedescribed.

FIGS. 1A and 1B show perspective views illustrating a first embodimentof a module according to the invention, FIGS. 2A and 2B show developmentviews of a circuit board provided to the module shown in FIGS. 1A and1B, FIG. 3 shows a perspective view illustrating a state in which thecircuit board shown in FIGS. 2A and 2B is assembled, FIG. 4 shows a planview illustrating an example of an angular velocity sensor provided tothe module shown in FIGS. 1A and 1B, FIGS. 5A and 5B show perspectiveviews illustrating a supporting member provided to the module shown inFIGS. 1A and 1B, FIG. 6 shows a transverse cross-sectional viewillustrating the supporting member to which the circuit board is fixed,FIGS. 7A and 7B show perspective views illustrating the supportingmember to which the circuit board is fixed, FIG. 8 shows a perspectiveview illustrating a base provided to the module shown in FIGS. 1A and1B, and FIGS. 9A and 9B show a plan view illustrating the supportingmember shown in FIGS. 5A and 5B and the base shown in FIG. 8.

In addition, in FIGS. 1A and 1B, the upper side in the drawings isdescribed as “up”, and the lower side in the drawings is described as“down” in the following description for convenience of description. Inaddition, as shown in FIGS. 1A and 1B, three axes which are orthogonalto each other are referred to as the “x-axis”, “y-axis”, and “z-axis”.The z-axis is an axis parallel to a normal line direction of a base 7,the x-axis is an axis parallel to the extension direction of a pair ofsides of the base 7, which are opposite to each other, in plan view ofthe base 7, and the y-axis is an axis parallel to the extensiondirection of another pair of sides of the base 7, which are opposite toeach other.

The module 1 shown in FIGS. 1A and 1B includes angular velocity sensors411 to 413, and is a three-axis gyro sensor module that is capable ofdetecting the angular velocity around the x-axis, the y-axis, and thez-axis that are orthogonal to each other. This module 1 is excellent inconvenience and may be appropriately used for, for example, motiontracing, motion tracking, a motion controller, a pedestrian deadreckoning (PDR), or the like.

As shown in FIGS. 1A and 1B, the module 1 includes an electroniccomponent 4, a mounting substrate 2 on which the electronic component 4is mounted, a supporting member 3 that supports and fixes the mountingsubstrate 2, and a casing 6 that maintains the supporting member 3. Inaddition, a cover member 10 of the module 1 shown in FIG. 1A is notshown in FIG. 1B.

Hereinafter, these members are sequentially described.

Mounting Substrate 2

The mounting substrate 2 is a rigid and flexible substrate in which arigid substrate, which is hard and therefore difficult to deform, and aflexible substrate, which is soft and therefore easy to deform, arecombined. As this mounting substrate 2, for example, a known rigid andflexible substrate in which a hard layer such as a glass epoxy substrateis adhered to both sides of a flexible substrate and this hard layer isused as the rigid substrate may be used.

Here, FIG. 2A shows a plan view taken when a developed mountingsubstrate 2 is seen from one face side thereof, and FIG. 2B shows a planview taken when the developed mounting substrate 2 is seen from a faceside opposite to FIG. 2A. As shown in FIGS. 2A and 2B, the mountingsubstrate 2 includes a first rigid substrate (a first substrate) 21, asecond rigid substrate (a second substrate) 22, a third rigid substrate(a third substrate) 23, a fourth rigid substrate (a fourth substrate)24, and a fifth rigid substrate (a fifth substrate) 25 that are disposedto be spaced from each other, and a flexible substrate 26 that connectsthese substrates.

The flexible substrate 26 includes a first connecting portion 261 thatconnects the first rigid substrate 21 and the second rigid substrate 22,a second connecting portion 262 that connects the first rigid substrate21 and the third rigid substrate 23, a third connecting portion 263 thatconnects the first rigid substrate 21 and the fourth rigid substrate 24,and a fourth connection portion 264 that connects the second rigidsubstrate 22 and the fifth rigid substrate 25. The first connectingportion 261, the second connecting portion 262, the third connectingportion 263, and the fourth connection portion 264 have flexibility,respectively, and therefore bending deformation may be easily performedin a face direction.

In addition, hole portions 21 a and 21 b are formed at both ends of thefirst rigid substrate 21, respectively, hole portions 22 a and 22 b areformed at both ends of the second rigid substrate 22, respectively, holeportions 23 a and 23 b are formed at both ends (both corner portionsthat are in a diagonal relationship) of the third rigid substrate 23,respectively, hole portions 24 a and 24 b are formed at both ends (bothcorner portions that are in a diagonal relationship) of the fourth rigidsubstrate 24, respectively, hole portions 25 a and 25 b are formed atboth ends of the fifth rigid substrate 25, respectively. These holeportions 21 a to 25 b are used to fix the first to fifth rigidsubstrates 21 to 25 to the supporting member 3. In addition, the holeportions include both a structure that penetrates from one face toanother face, and a structure in which an opening is provided on oneface and which does not penetrate to another face.

The mounting substrate 2 may be deformed into a rectangularparallelepiped shape shown in FIG. 3 by bending (curving) the respectiveconnecting portions 261 to 264 of the flexible substrate 26.Specifically, when the connecting portions 261 to 264 are bent in amanner such that the front-side mounting faces 211 to 251 of therespective rigid substrates 21 to 25 face an inner side, the mountingsubstrate 2 may be deformed into a rectangular parallelepiped shape inwhich adjacent rigid substrates are orthogonal to each other. In thisstate, the first rigid substrate 21 makes up a bottom face, the secondrigid substrate 22 makes up a top face, and the third, the fourth, andthe fifth rigid substrates 23, 24, and 25 make up side faces. As shownin FIGS. 1A and 1B, the mounting substrate 2 is supported by and fixedto the supporting member 3 in this deformed state. In other words, themounting substrate 2 is designed so as to be deformed into a shapecorresponding to the supporting member 3.

In this manner, when the mounting substrate 2 is configured with a rigidand flexible substrate, since the mounting substrate 2 may be easilydeformed, the fixing of the mounting substrate 2 to the supportingmember 3 becomes simple. In addition, since the respective rigidsubstrates 21 to 25 are collectively connected by the connectingportions 261 to 264, in this regard, the fixing of the mountingsubstrate 2 to the supporting member 3 may be performed in a simple andsmooth manner. In addition, the plurality of rigid substrates isprovided, such that the degree of freedom in arrangement of theelectronic components 4 increases.

In addition, the electronic components 4 are mounted on the hard rigidsubstrates, such that unnecessary vibration of the electronic components4 (particularly, angular velocity sensors 411 to 413) may be suppressed,and therefore detection accuracy of the module 1 is improved. Inaddition, the electronic components 4 may be easily mounted on themounting substrate 2. In addition, a degree of parallelization of theelectronic components 4 may be easily obtained, and particularly, theangular velocity sensors 411 to 413 may be simply set in a desiredposture, and the posture may be maintained. In addition, when theelectronic components 4 are mounted on the rigid substrates, theelectronic components 4 may be mounted with high accuracy.

Particularly, in this embodiment, the first rigid substrate 21 has afirst cut-out portion 21 c, a second cut-out portion 21 d, and a thirdcut-out portion 21 e that are opened toward an edge (an outer periphery)thereof. The first cut-out portion 21 c is formed with a step differencewith respect to a right side of the first rigid substrate 21 in FIG. 2A,and the first connecting portion 261 extends from the first cut-outportion 21 c. Similarly, the second cut-out portion 21 d is formed witha step difference with respect to an upper side of the first rigidsubstrate 21 in FIG. 2A, and the second connecting portion 262 extendsfrom the second cut-out portion 21 d. In addition, the third cut-outportion 21 e is formed with a step difference with respect to a leftside of the first rigid substrate 21 in FIG. 2A, and the thirdconnecting portion 263 extends from the third cut-out portion 21 e.

When the first cut-out portion 21 c is formed in the first rigidsubstrate 21, the first connecting portion 261 may be simplybending-deformed in the vicinity of a connecting portion with the firstrigid substrate 21 (relatively on the first rigid substrate 21 side),and a radius of curvature at the time of bending deformation may bemaintained to be relatively large. In addition, excessive protrusion ofa bent portion from an outer periphery of the first rigid substrate 21is suppressed and therefore in regard to the module 1, a reduction insize may be promoted. In addition, in regard to the second cut-outportion 21 d and the third cut-out portion 21 e, the same effect may beobtained.

In addition, in this embodiment, the second rigid substrate 22 has afourth cut-out portion 22 c and a fifth cut-out portion 22 d that areopened to an edge (outer periphery) thereof. The fourth cut-out portion22 c is formed with a step difference with respect to a left side of thesecond rigid substrate 22 in FIG. 2A, and the first connecting portion261 extends from the fourth cut-out portion 22 c. Similarly, the fifthcut-out portion 22 d is formed with a step difference with respect to alower side of the second rigid substrate 22 in FIG. 2A, and the fourthconnection portion 264 extends from the fifth cut-out portion 22 d.

When the fourth cut-out portion 22 c is formed in the second rigidsubstrate 22, the first connecting portion 261 may be simplybending-deformed in the vicinity of a connecting portion with the secondrigid substrate 22 (relatively on the second rigid substrate 22 side),and a radius of curvature at the time of bending deformation may bemaintained to be relatively large. In addition, excessive protrusion ofa bent portion from an outer periphery of the second rigid substrate 22is suppressed and therefore in regard to the module 1, a reduction insize may be promoted. In addition, in regard to the fifth cut-outportion 22 d, the same effect may be obtained.

Hereinbefore, a description has been made with respect to the mountingsubstrate 2. In addition, conductor patterns (not shown) are formed inthe respective rigid substrates 21 to 25 and the flexible substrate 26of the mounting substrate 2, and the plurality of electronic components4 are electrically connected through the conductor patterns in anappropriate manner. Hereinafter, for easy description, faces of therespective rigid substrates 21 to 25, which are shown in FIG. 2A, arereferred to as “frond-side mounting faces”, and faces shown in FIG. 2Bare referred to as “rear-side mounting faces”.

In addition, in the mounting substrate 2, a ground layer (not shown) isformed, and this ground layer exhibits a function of interrupting anexternal magnetic field. Therefore, in a state shown in FIG. 3, inregard to the electronic components 4 positioned at an inner side of themounting substrate 2 (that is, electronic components 4 that are mountedon the front-side mounting faces 211 to 251), an effect due to anexternal magnetic field (exogenous noise) from the outside of the module1 may be excluded.

Electronic Components 4

As shown in FIGS. 2A and 2B, the plurality of electronic components 4are mounted on the mounting substrate 2.

As the electronic components 4, three one-axis detection type angularvelocity sensors 411 to 413, a three-axis detection type accelerationsensor 42, a first power supply circuit 431 and a second power supplycircuit 432 that drives various electronic components, an amplifyingcircuit 44 that amplifies an output signal from the sensors 411 to 413and 42, an analog/digital converting circuit 45 that converts an analogsignal, which is amplified by the amplifying circuit 44, to a digitalsignal, a microcontroller 46 that performs a desired control, anonvolatile memory 47 such as an EEPROM, an orientation sensor (magneticsensor) 48 that detects orientation, and a connector 49 for an interfaceare mounted on the mounting substrate 2. In addition, here, as theacceleration sensor 42, a sensor having a three-axis detecting structurewith one device is used, but similarly to the angular velocity sensor,three one-axis detection type acceleration sensors may be used.

Hereinafter, disposition of these electronic components 4 will bedescribed in detail.

First Rigid Substrate 21

The first power supply circuit 431, the amplifying circuit 44, and theanalog/digital converting circuit 45 are mounted on a front-sidemounting face 211 of the first rigid substrate 21, and the angularvelocity sensor (first sensor device) 411 that detects an angularvelocity around the z-axis, and the acceleration sensor 42 are mountedon a rear-side mounting face 212. In addition, the angular velocitysensor 411 and the acceleration sensor 42 may be mounted on thefront-side mounting face 211, and the first power supply circuit 431,the amplifying circuit 44, and the analog/digital converting circuit 45may be mounted on the rear-side mounting face 212.

The analog/digital converting circuit 45 has a size larger than that ofother electronic components 4 (the first power supply circuit 431 andthe amplifying circuit 44) that are mounted on the front-side mountingface 211. Therefore, it is preferable that the analog/digital convertingcircuit 45 be disposed at a central portion of the front-side mountingface 211. Due to this configuration, the analog/digital convertingcircuit 45 may be effectively used as a reinforcing member that augmentsthe strength of the first rigid substrate 21. Therefore, unintendedvibration caused by bending deformation of the first rigid substrate 21is suppressed, and therefore unnecessary vibration is not transmitted tothe angular velocity sensors 411 to 413, and angular velocity detectionaccuracy by the angular velocity sensors 411 to 413 (particularly, theangular velocity sensor 411 mounted on the first rigid substrate 21) israised.

In addition, it is preferable that the angular velocity sensor 411 andthe acceleration sensor 42 be disposed at an edge portion of therear-side mounting face 212 (particularly, in the vicinity of either thehole portion 21 a or the hole portion 21 b). As described later, thefirst rigid substrate 21 is fixed to the supporting member 3 by beingscrew-coupled thereto with the hole portions 21 a and 21 b interposedtherebetween. As a result, the vicinity of the hole portions 21 a and 21b (the edge portion of the first rigid substrate 21) is difficult todeform and unnecessary vibration hardly occurs. Therefore, when theangular velocity sensor 411 and the acceleration sensor 42 are disposedat this place, the angular velocity and the acceleration may be detectedwith relatively high accuracy.

In addition, when the angular velocity sensor 411 and the accelerationsensor 42 are mounted on the rear-side mounting face 212, the distancefrom the microcontroller 46 may further increase in a state in which themounting substrate 2 is fixed to the supporting member 3. In addition, aground layer of the first rigid substrate 21 may be positioned betweenthe angular velocity sensor 411 and the acceleration sensor 42, and themicrocontroller 46. Therefore, it is possible to prevent radiation noisegenerated from the microcontroller 46 from having an adverse effect onthe angular velocity sensor 411 and the acceleration sensor 42, andtherefore the detection accuracy of the angular velocity sensor 411 andthe acceleration sensor 42 may be improved.

Second Rigid Substrate 22

The microcontroller 46 is mounted on a front-side mounting face 221 ofthe second rigid substrate 22, and the second power supply circuit 432that activates the microcontroller 46, the non-volatile memory 47 thatstores data, and the orientation sensor 48 are mounted on a rear-sidemounting face 222.

The microcontroller 46 has a size larger than that of other electroniccomponents 4 (the nonvolatile memory 47 and the orientation sensor 48)mounted on the second rigid substrate 22. Therefore, it is preferablethat the microcontroller 46 be disposed at a central portion of thefront-side mounting face 221. Due to this configuration, themicrocontroller 46 may be effectively used as a reinforcing member thataugments the strength of the second rigid substrate 22. Therefore,unnecessary vibration caused by bending deformation of the second rigidsubstrate 22 is suppressed, and therefore unnecessary vibration is nottransmitted to the angular velocity sensors 411 to 413, and angularvelocity detection accuracy by the angular velocity sensors 411 to 413is raised.

In addition, radiation noise generated from the microcontroller 46 isblocked by the ground layer of the second rigid substrate 22, such thatwhen the orientation sensor 48 is mounted on a mounting face that isopposite to the microcontroller 46, it is possible to effectivelyprevent the radiation noise (magnetic field) from reaching theorientation sensor 48 and having an adverse effect on the orientationsensor 48. Therefore, the detection accuracy of the orientation sensor48 may be improved.

Third Rigid Substrate 23

The angular velocity sensor (second sensor device) 412 that detects anangular velocity around the x-axis is mounted on a front-side mountingface 231 of the third rigid substrate 23.

Fourth Rigid Substrate 24

The angular velocity sensor (third sensor device) 413 that detects anangular velocity around the y-axis is mounted on a front-side mountingface 241 of the fourth rigid substrate 24.

Fifth Rigid Substrate 25

The connector 49 for an interface is mounted on a rear-side mountingface 252 of the fifth rigid substrate 25. According to thisconfiguration, an output of a signal, or an input of a signal such as atemperature correction coefficient may be performed in a simple manner.

Hereinbefore, a description has been made in detail with respect to thearrangement of the electronic components 4.

In the mounting substrate 2, analog circuits including the first powersupply circuit 431, the amplifying circuit 44, the analog/digitalconverting circuit 45 are provided in the first rigid substrate 21, anda digital circuit including the microcontroller 46 is provided in thesecond rigid substrate 22. In this manner, when the analog circuits andthe digital circuit are formed in substrates different from each other,Therefore, the propagation of high-frequency noise generated due to thedigital circuit into the analog circuits may be suppressed and thereforeexcellent reliability and detection accuracy may be exhibited.

In addition, in this embodiment, a power supply for the analog circuitsand a power supply for the digital circuit are separately prepared. Thatis, as the power supply for the analog circuits, the first power supplycircuit 431 is provided, and as the power supply for the digitalcircuit, the second power supply circuit 432 is provided. In addition,in regard to the ground layer, a ground layer for the analog circuit anda ground layer for the digital circuit are provided separately.According to this configuration, the generation of the noise may besuppressed in a relatively effective manner, and therefore the detectionaccuracy of the module 1 is further raised.

The angular velocity sensors 411 to 413 are not particularly limited aslong as the angular velocity may be detected, and a known one-axisdetection type angular velocity sensor may be used. As these angularvelocity sensors 411 to 413, for example, a sensor provided with avibrating piece 5 shown in FIG. 4 may be used.

The vibrating piece 5 is formed of quartz (piezoelectric material). Inaddition, the vibrating piece 5 has a base portion 51, a pair ofvibrating arms 52 and 53 for detection, which extends in the verticaldirection on a plane of paper from both sides of the base portion 51, apair of connecting arms 54 and 55 that extends in the horizontaldirection on the plane of paper from both sides of the base portion 51,and respective pairs of vibrating arms 56, 57, 58, and 59 for driving,which extends in the vertical direction on the plane of paper from bothsides of distal ends of the respective connecting arms 54 and 55. Inaddition, a detection electrode (not shown) is formed on a surface ofeach of the vibrating arms 52 and 53 for detection, and a drivingelectrode (not shown) is formed on a surface of each of the vibratingarms 56, 57, 58, and 59 for driving.

In this vibrating piece 5, in a state in which when a voltage is appliedto the driving electrode and thereby the vibrating arms 56 and 58 fordriving and the vibrating arms 57 and 59 for driving are made to vibrateso as to repeat approaching and separation from each other, when anangular velocity ω around a normal line A of the vibrating piece 5 isapplied, a Coriolis force is applied to the vibrating piece 5 and thevibration of the vibrating arms 52 and 53 for detection is excited. Inaddition, the angular velocity applied to the vibrating piece 5 may beobtained by detecting strain of the vibrating arms 52 and 53 fordetection, which is generated due to vibration of the vibrating arms 52and 53 for detection, using the detection electrode.

Supporting Member

As shown in FIGS. 5A and 5B and FIG. 6, the supporting member 3 has asubstantially rectangular parallelepiped shape, and has a top face 31and a bottom face 32 disposed to be opposite to each other, and fourside faces 33, 34, 35, and 36 that connect the top face 31 and thebottom face 32. In this supporting member 3, at least the two adjacentside faces, and the top face 31 or the bottom face 32 are formed withgood accuracy so as to be orthogonal to each other. In addition, in thisembodiment, all of the faces that are adjacent to each other are formedwith good accuracy in a manner such that all of the adjacent faces areorthogonal to each other.

The bottom face 32, and the side faces 33 and 34 are faces to fix thefirst, third, and fourth rigid substrates 21, 23, and 24 on which theangular velocity sensors 411 to 413 are mounted as described later.Therefore, when these three faces are formed so as to be orthogonal toeach other, the angular velocity sensors 411 to 413 may be accuratelydisposed in a posture in which respective detection axes A1 to A3 areorthogonal to each other. As a result, according to this module 1, theangular velocity around the respective axes (x-axis, y-axis, and z-axis)may be detected with high accuracy.

Side Face 33

The side face 33 makes up a fixing face that fixes the third rigidsubstrate 23. The third rigid substrate 23 is fixed to the side face 33in a state in which the front-side mounting face 231 faces thesupporting member 3 side (inner side). Specifically, the supportingmember 3 has two protrusions 332 and 333 that protrude from both ends ofthe side face 33, and the hole portions 23 a and 23 b formed in thethird rigid substrate 23 engage with the protrusions 332 and 333.Therefore, the third rigid substrate 23 is fixed to the side face 33 asshown in FIGS. 7A and 7B.

In this manner, by using two protrusions 332 and 333, the third rigidsubstrate 23 may be fixed to the side face 33 while performingpositioning of the third rigid substrate 23 with respect to the sideface 33. Particularly, when the protrusions 332 and 333 are formed onboth ends of the side face 33, a spaced distance between the protrusions332 and 333 is lengthened, and therefore the positioning of the thirdrigid substrate 23 may be performed with good accuracy.

It is preferable that in the fixing of the third rigid substrate 23 tothe side face 33, adhesion using an adhesive also be used. Due to thisconfiguration, the third rigid substrate 23 may be strongly fixed to theside face 33. This is true of other rigid substrates 21, 22, 24, and 25described later.

In addition, the supporting member 3 has a concave portion 331 that isopened in the side face 33. This concave portion 331 is formed inaccordance with a position and an exterior appearance of the angularvelocity sensor 412, and in a state in which the third rigid substrate23 is fixed to the side face 33, the angular velocity sensor 412 isaccommodated in the concave portion 331. That is, the concave portion331 makes up a relief portion that prevents the supporting member 3 andthe angular velocity sensor 412 from being brought into contact witheach other. When this concave portion 331 is formed, an inner space ofthe supporting member 3 may be effectively utilized and therefore thereduction in size of the module 1 may be promoted.

In addition, a zenith face (face opposite to a face that is mounted onthe first rigid substrate 21) of the angular velocity sensor 412 and asurface of the concave portion 331 of the supporting member may bebonded with adhesive or the like. According to this configuration, thesensor device and the supporting member may be strongly bonded to eachother.

Side Face 34

The side face 34 makes up a fixing face that fixes the fourth rigidsubstrate 24. The fourth rigid substrate 24 is fixed to the side face 34in a state in which the front-side mounting face 241 faces thesupporting member 3 side (an inner side). Specifically, the supportingmember 3 has two protrusions 342 and 343 that protrude from both ends ofthe side face 34, and the hole portions 24 a and 24 b formed in thefourth rigid substrate 24 engage with the protrusions 342 and 343.Therefore, as shown in FIGS. 7A and 7B, the fourth rigid substrate 24 isfixed to the side face 34.

In addition, the supporting member 3 has a concave portion 341 that isopened in the side face 34. This concave portion 341 is formed inaccordance with a position and an exterior appearance of the angularvelocity sensor 413, and in a state in which the fourth rigid substrate24 is fixed to the side face 34, the angular velocity sensor 413 isaccommodated in the concave portion 341. That is, the concave portion341 makes up a relief portion that prevents the supporting member 3 andthe angular velocity sensor 413 from being brought into contact witheach other. When this concave portion 341 is formed, an inner space ofthe supporting member 3 may be effectively utilized and therefore thereduction in size of the module 1 may be promoted.

In addition, a zenith face (face opposite to a face that is mounted onthe second rigid substrate 22) of the angular velocity sensor 413 and asurface of the concave portion 341 of the supporting member may bebonded with adhesive or the like. According to this configuration, thesensor device and the supporting member may be strongly bonded to eachother.

Side Face 35

The side face 35 makes up a fixing face that fixes the fifth rigidsubstrate 25. The fifth rigid substrate 25 is fixed to the side face 35in a state in which the front-side mounting face 251 faces thesupporting member 3 side (an inner side). That is, the fifth rigidsubstrate 25 is fixed to the side face 35 in a state in which theconnector 49 is exposed to the outside of the module 1. Specifically,the supporting member 3 has two protrusions 352 and 353 that protrudefrom both ends of the side face 35. The hole portions 25 a and 25 bformed in the fifth rigid substrate 25 engage with the protrusions 352and 353. Therefore, as shown in FIGS. 7A and 7B, the fifth rigidsubstrate 25 is fixed to the side face 35.

Bottom Face 32

The bottom face 32 makes up a fixing face that fixes the first rigidsubstrate 21. The first rigid substrate 21 is fixed to the bottom face32 in a state in which the front-side mounting face 211 faces thesupporting member 3 side (inner side). Specifically, the supportingmember 3 is provided with two screw holes 32 a and 32 b that are formedat two corner portions of the bottom face 32, which are in a diagonalrelationship. The screw holes 32 a and 32 b and the hole portions 21 aand 21 b formed on the first rigid substrate 21 are made to face eachother and are screw-coupled with screws 81 and 82, and thereby the firstrigid substrate 21 is fixed to the bottom face 32 as shown in FIGS. 7Aand 7B. In addition, protruding portions may be provided instead of thescrew holes 32 a and 32 b, and the protruding portions and the holeportions 21 a and 21 b may engage with each other to perform the fixing.

In addition, the supporting member 3 is provided with a penetration hole37 that penetrates through the top face 31 and the bottom face 32. In astate in which the first rigid substrate 21 is fixed to the bottom face32, the first power supply circuit 431, the amplifying circuit 44, andthe analog/digital converting circuit 45 that are mounted on thefront-side mounting face 211 are accommodated in the penetration hole37. That is, the penetration hole 37 functions as an accommodation spaceof the angular velocity sensor 413 and the acceleration sensor 42, andtherefore contributes to the reduction in size and thickness of themodule. In addition, the penetration hole 37 makes up a relief portionthat prevents the supporting member 3, and the first power supplycircuit 431, the amplifying circuit 44, and the analog/digitalconverting circuit 45 from being brought into contact with each other.When this penetration hole 37 is formed, the inner space of thesupporting member 3 may be effectively utilized and therefore areduction in the size (reduction in thickness) of the module 1 may bepromoted.

Top Face 31

The top face 31 makes up a fixing face that fixes the second rigidsubstrate 22. The second rigid substrate 22 is fixed to the top face 31in a state in which the front-side mounting face 221 faces thesupporting member 3 side (inner side). Specifically, the supportingmember 3 is provided with two screw holes 31 a and 31 b that are formedat two corner portions of the top face 31, which are in a diagonalrelationship. These screw holes 31 a and 31 b are formed to be oppositeto the screw holes 32 a and 32 b that are formed in the bottom face 32.The screw holes 31 a and 31 b and the hole portions 22 a and 22 b formedin the second rigid substrate 22 are made to face each other and arescrew-coupled with screws 83 and 84, and thereby the second rigidsubstrate 22 is fixed to the top face 31 as shown in FIGS. 7A and 7B.

In addition, as described above, the supporting member 3 is providedwith the penetration hole 37. In a state in which the second rigidsubstrate 22 is fixed to the top face 31, the microcontroller 46 mountedon the front-side mounting face 221 is accommodated in the penetrationhole 37. That is, the penetration hole 37 also functions as a reliefportion that prevents the supporting member 3 and the microcontroller 46from being brought into contact with each other. When the penetrationhole 37 is formed, an inner space of the supporting member 3 may beeffectively used, and therefore the reduction in size (reduction inthickness) of the module 1 may be promoted.

In addition, two penetration holes 381 and 382 that penetrate throughthe top face 31 and the bottom face 32 at edge portion thereof areformed in the supporting member 3. These two penetration holes 381 and382 are formed so as to penetrate through two corner portions of the topface 31, which are in a diagonal relationship and in which the screwholes 31 a and 31 b are not formed, and corner portions of the bottomface 32, which correspond to the two corner portions. As describedlater, these penetration holes 381 and 382 are screw holes to which ascrew is inserted when the supporting member 3 is screw-coupled to thebase 7.

In addition, a constituent material of the supporting member 3 is notparticularly limited, but for example, a hard material is preferable soas to prevent deformation from occurring when a pressure is applied fromthe outside. According to this configuration, a state in which thebottom face 32, the side face 33, and the side face 34 are orthogonal toeach other may be reliably maintained and therefore the detectionaccuracy of the module 1 may be maintained to be high.

This material is not particularly limited, but as this material, variouskinds of metal such as iron, nickel, copper, and aluminum, or alloys orintermetallic compounds containing at least one kind from among thesekinds of metal, or oxides of these kinds of metal may be exemplified.For example, as the alloys, stainless steel, inconel, and in additionthereto, for example, various aluminum-based alloys such as duraluminmay be exemplified.

In this manner, when the supporting member 3 is formed of the metallicmaterial, the following effect may be exhibited. That is, when thesupporting member 3 is formed of a material having a high electricalconductivity like a metallic material, for example, radiation noisegenerated from a microcontroller 46 may be blocked by the supportingmember 3. Therefore, it is possible to prevent this radiation noise fromreaching the angular velocity sensors 412 and 413 in the concaveportions 331 and 341 and having an adverse effect on the sensors. As aresult, the angular velocity may be detected by the angular velocitysensors 412 and 413 with high accuracy.

In addition, as the hard material, in addition to the metallicmaterials, for example, polyolefin such as polyethylene, polypropylene,and ethylene-propylene copolymer, polyester such as polyvinyl chloride,polystyrene, polyamide, polyimide, polycarbonate, poly-(4-methylpentene-1), ionomer, an acrylic resin, polymethyl methacrylate,acrylonitrile-butadiene-styrene copolymer (ABS resin),acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer,polyethylene terephthalate (PET), and polybutylene terephthalate (PBT),polyether, polyether ketone (PEK), polyether ether ketone (PEEK),polyether imide, polyacetal (POM), polyphenylene oxide, polysulfone,polyether sulfone, polyphenylene sulfide, polyarylate, aromaticpolyester (liquid crystal polymer), polytetrafluoroethylene,polyvinylidene fluoride, and in addition to these, a fluorine-basedresin, an epoxy resin, a phenol resin, a urea resin, a melamine resin, asilicone resin, polyurethane, or the like, or copolymers, blends,polymer alloys, and the like, which contain these as a main component,may be exemplified, and one kind or two or more kinds of these may becombined to be used.

In addition, as the constituent material of the supporting member 3, anelastic material that is capable of exhibiting a vibration-proof andvibration isolating function that absorbs unnecessary vibration ispreferable. As this material, for example, various rubber materials(particularly, vulcanized rubber) such as natural rubber, isoprenerubber, butadiene rubber, styrene-butadiene rubber, nitrile rubber,chloroprene rubber, butyl rubber, acrylic rubber, ethylene-propylenerubber, silicone rubber, and fluoro-rubber, various kinds ofthermoplastic elastomer such as styrene series, polyolefin series,polyvinyl chloride series, polyurethane series, polyester series,polyamide series, polybutadiene series, trans-polyisoprene series,fluoro-rubber series, and chlorinated polyethylene series may beexemplified, and one kind or two or more kinds of these may be combinedto be used.

In addition, as the constituent material of the supporting member 3,vibration-isolating steel is preferably used so as to make ananti-deformation property and the vibration-proofing andvibration-isolating functions be compatible with each other.

Since this supporting member 3 is provided with three faces that areorthogonal to each other, that is, the bottom face 32, the side face 33,and the side face 34, the three angular velocity sensors 411 to 413 maybe disposed to be orthogonal to each other in a simple and reliablemanner only by fixing the first rigid substrate 21 on which the angularvelocity sensor 411 is mounted to the bottom face 32, by fixing thethird rigid substrate 23 on which the angular velocity sensor 412 ismounted to the side face 33, and by fixing the fourth rigid substrate 24on which the angular velocity sensor 413 is mounted to the side face 34.That is, the three angular velocity sensors 411 to 413 may be disposedin a manner such that a detection axis A1 of the angular velocity sensor411, a detection axis A2 of the angular velocity sensor 412, and adetection axis A3 of the angular velocity sensor 413 are orthogonal toeach other. Therefore, the angular velocity detection accuracy of themodule 1 may be improved in a simple manner.

In addition, the angular velocity sensors 412 and 413 are positioned onthe supporting member 3 side in relation to the mounting substrate 2.Therefore, the angular velocity sensor 412 is prevented from beingexposed to the outside of the module 1 by the third rigid substrate 23,and the angular velocity sensor 413 is prevented from being exposed tothe outside of the module 1 by the fourth rigid substrate 24. Accordingto this arrangement, for example, at the time of manufacturing themodule 1, or at the time of assembling the module 1 to anotherelectronic apparatus, the angular velocity sensors 412 and 413 do notcome into contact with a worker, a manufacturing apparatus, or the like,and therefore these sensors may be effectively prevented from beingbroken. In addition, as described above, an external magnetic field maybe blocked by the ground layer provided to the mounting substrate 2,such that the angular velocity may be detected by the sensors with goodaccuracy while the angular velocity sensors 412 and 413 are not affectedby the magnetic field.

Casing

As shown in FIGS. 1A and 1B, the casing (maintaining member) 6 includesthe base 7 to which the supporting member 3 is fixed, and the covermember (cap) 10 that covers the supporting member 3 fixed to the base 7.Hereinafter, the base 7 and the cover member 10 will be sequentiallydescribed.

Base 7

As shown in FIG. 8, the base 7 is a plate-shaped member, and has asubstantially rectangular shape in plan view. In this manner, when thebase 7 is made to have the substantially rectangular shape in plan view,it is easy to confirm the respective axes of x-axis, y-axis, and z-axis(the detection axes A1 to A3 of the angular velocity sensors 411 to 413)from the outside of the module 1, and when the module 1 is mounted on anobject (not shown) (for example, a circuit board on the electronicapparatus side) or the like, the mounting (positioning) of the module 1may be easy.

In addition, the bottom face of the base 7 is parallel to the xy plane(a plane made by the x-axis and y-axis). Therefore, when the module 1 ismounted on the object, a mounting face of the object becomes parallel tothe xy plane. As a result, for example, in an electronic apparatus 500described later or the like, arrangement of the object may be easilyperformed, and therefore the angular velocity around the respective axesmay be detected by the module 1 in a relatively exact manner.

In addition, elongated holes 711 and 712 that are opened to the outerperiphery (outer edge) are formed at two corner portions of the base 7,which are positioned in a diagonal relationship, respectively. Theseelongated holes 711 and 712 extend in the same direction as each other.These elongated holes 711 and 712 are screw holes to fix the module 1 tothe object. That is, the elongated holes 711 and 712 make up a fixingportion that fixes the module 1 to the object. When the module 1 isscrew-coupled to the object using the elongated holes 711 and 712, themodule 1 may be fixed to the object in a simple and reliable manner.

Here, when one of the elongated holes 711 and 712 is in a state of beingtemporarily fixed to the object with a screw, the module 1 may be madeto rotate around the z-axis on the object with the screw made as thecenter of the rotational movement. Therefore, first, the module 1 istemporarily fixed (screw-coupled) using one elongated hole, and then thepositioning of the module 1 around the z-axis is performed, and then theother elongated hole is screw-coupled, and finally both screws aretightened, and thereby the module 1 may be fixed to the object in astate in which the module 1 is positioned around the z-axis with goodaccuracy.

In addition, in a state in which the module 1 is temporarily fixed tothe object using the elongated holes 711 and 712, the module 1 may bemade to slide with respect to the object in an extension direction ofthe elongated holes 711 and 712. Therefore, the position of the module 1in the x-axis direction and the y-axis direction may be minutelyadjusted with respect to the object. As a result, the positioning of themodule 1 with respect to the object may be performed with good accuracy.

In addition, the base 7 is provided with a concave portion 72, which isopened, at a central portion of the top face excluding an edge portion.The concave portion 72 functions as an accommodation portion thataccommodates the angular velocity sensor 411 and the acceleration sensor42 that are mounted on the rear-side mounting face 212 of the firstrigid substrate 21, in a state in which the supporting member 3 is fixedto the base 7. In other words, the concave portion 72 makes up a reliefportion that prevents the base 7, and the angular velocity sensor 411and the acceleration sensor 42 from being brought into contact with eachother. When this concave portion 72 is formed, the space of the base 7may be effectively utilized and therefore the reduction in size(reduction in thickness) of the module 1 may be promoted.

In addition, the base 7 is provided with four alignment portions 741,742, 743, and 744. These alignment portions 741 to 744 have a functionof performing the positioning of the supporting member 3 with respect tothe base 7 around the respective axes of x-axis, y-axis, and z-axis.Specifically, the alignment portions 741 to 744 has a function ofpositioning the supporting member 3 with respect to the base 7 in amanner such that a plane made by the detection axis A2 of the angularvelocity sensor 412 and the detection axis A3 of the angular velocitysensor 413 becomes parallel to the xy plane, and the detection axis A1of the angular velocity sensor 411 becomes parallel to the z-axis.

These four alignment portions 741 to 744 are provided at four cornerportions of the concave portion 72, respectively, and protrude from thebottom face of the concave portion 72. In addition, alignment portions741, 742, 743, and 744 have mounting faces 741 a, 742 a, 743 a, and 744a that are made up by planes parallel to the xy plane, respectively, andthese four mounting faces 741 a to 744 a are positioned to be flush withthe xy plane. Therefore, when the supporting member 3 is mounted onthese mounting faces 741 a to 744 a in order for the bottom face 32 tobe opposite to the mounting faces, the detection axis A1 of the angularvelocity sensor 411 becomes parallel to the z-axis. In this manner, thepositioning of the angular velocity sensor 411 around the x-axis andy-axis with respect to the base 7 may be simply performed with goodaccuracy by only mounting the supporting member 3 on the four alignmentportions 741 to 744.

Particularly, as is the case with this embodiment, when the fouralignment portions 741 to 744 are provided to the corner portions of theconcave portion 72, that is, the four alignment portions 741 to 744 areprovided at the edge portions of the concave portion 72 so as to bespaced from each other, the alignment portions 741 to 742 may be spacedgreatly apart from each other, and the supporting member 3 may bemounted on the alignment portions 741 to 744 in a relatively stablemanner.

In these alignment portions 741 to 744, two alignment portions 742 and744 that are in a diagonal relationship have screw holes 761 and 762,respectively. The screw holes 761 and 762 are screw holes that fix thesupporting member 3 mounted on the base 7 (the mounting faces 741 a to744 a) to the base 7. That is, the screw holes 761 and 762 make up afixing portion that fixes the supporting member 3 to the base 7.

The screw hole 761 is formed to be opened to the mounting face 742 a,and the screw hole 762 is formed to be opened to the mounting face 744a. In addition, as shown in FIGS. 9A and 9B, in xy plane view, adistance D between centers of the screw holes 761 and 762 issubstantially the same as a distance D′ between centers of thepenetration holes 381 and 382 of the supporting member 3. In addition,an angle θ1 made by a straight line L connecting centers of the screwholes 761 and 762 and the x-axis is substantially the same as an angleθ1′ made by a straight line L′ connecting centers (center axes) of thepenetration holes 381 and 382 and a face parallel to the side face 34,and an angle θ2 made by the straight line L and the y-axis issubstantially the same as an angle □θ2′ made by the straight line L′ anda face parallel to the side face 33.

Therefore, when the supporting member 3 is mounted on the base 7 (themounting faces 741 a to 744 a) in a manner such that the screw hole 761is opposite to (communicates with) the penetration hole 381, and thescrew hole 762 is opposite to (communicates with) the penetration hole382, the detection axis A2 of the angular velocity sensor 412 fixed tothe side face 33 of the supporting member 3 and the x-axis becomesubstantially parallel to each other, and the detection axis A3 of theangular velocity sensor 413 fixed to the side face 34 and the y-axisbecome substantially parallel to each other. In addition, when screws 85and 86 are fastened into the screw holes 761 and 762 through thepenetration holes 381 and 382, the supporting member 3 is completelyfixed to the base 7 while maintaining a state in which the detectionaxes A1, A2, and A3 of the angular velocity sensors 411, 412, and 413are parallel to the z-axis, x-axis, and y-axis, respectively (refer toFIG. 1B).

In this manner, according to the base 7, the positioning of thesupporting member 3 around the z-axis with respect to the base 7 may besimply performed with good accuracy by only performing positionalalignment between the penetration holes 381 and 382, and the screw holes761 and 762, and performing the fixing. In other words, when thedetection axes A1, A2, and A3 of the angular velocity sensors 411, 412,and 413 are not parallel to the z-axis, x-axis, and y-axis,respectively, the supporting member 3 may not be fixed to the base 7,such that the positioning of the supporting member 3 with respect to thebase 7 may be performed in a relatively reliable manner. In this manner,the screw holes 761 and 762 are used as fixing portions that fix thesupporting member 3 to the base 7, and are used as alignment portionsthat perform the positioning of the supporting member 3 around thez-axis, and therefore the positioning of the supporting member 3 withrespect to the base 7 may be performed in a relatively accurate manner.

In addition, in regard to the fixing of the supporting member 3 to thebase 7, adhesion using adhesive may be used together with thescrew-coupling. Therefore, since an adhesive layer is interposed betweenthe base 7 and the supporting member 3, unnecessary vibration of thesupporting member 3 is suppressed. As a result thereof, the detectionaccuracy of the angular velocity sensors 411 to 413 or the like may beimproved.

In addition, in the alignment portions 741 to 744, the two alignmentportions 741 and 743, which are in a diagonal relationship, are providedwith concave portions 751 and 752, respectively. The concave portion 751is formed to be opened to the mounting face 741 a, and the concaveportion 752 is formed to be opened to the mounting face 743 a. Theseconcave portions 751 and 752 makeup a relief portion (accommodationportion) that prevents the base 7 and head portions (heads) of thescrews 82 and 81 from being brought into contact with each other at thetime of fixing the supporting member 3 to the base 7. Therefore, theconcave portions 751 and 752 have a shape and size capable ofaccommodating the head portions of the screws 82 and 81. When theseconcave portions 751 and 752 are provided, breakage of the supportingmember 3 and the base 7, deformation of the supporting member 3, or thelike may be prevented and therefore the reliability of the module 1 isimproved.

In addition, the concave portions 751 and 752 also function as atemporary alignment portion that performs the positioning of thesupporting member 3 around the z-axis with respect to the base 7. Thatis, when the supporting member 3 is mounted on the base 7 in a mannersuch that the head portions of the screws 81 and 82 are accommodated inthe concave portions 751 and 752, the positioning of the supportingmember 3 around the z-axis with respect to the base 7 may besubstantially performed. In addition, in this state, excessiverotational movement of the supporting member 3 around the z-axis isrestricted, such that the positional alignment between the screw holes761 and 762 and the penetration holes 381 and 382 may be simplyperformed.

It is preferable that the concave portion 751 have a shape capable ofregulating movement of the head portion of the screw 81 within theconcave portion 751 in the xy plane direction so as to effectivelyexhibit the function of the temporary alignment portion. This is true ofthe concave portion 752. According to this configuration, in a state inwhich the head portions of the screw 81 and 82 are accommodated in theconcave portions 751 and 752, respectively, the shaking (rotationalmovement around the z-axis) of the supporting member 3 is furthersuppressed, and the above-described temporary positioning of thesupporting member 3 may be further effectively performed.

Although not being particularly limited, a material having a vibrationdamping characteristic is preferable as a constituent material of thebase 7. According to this configuration, unnecessary vibration of thesupporting member 3 is suppressed and therefore the detection accuracyof the angular velocity sensors 411 to 413 or the like may be improved.As this material, for example, various vibration damping alloys such asa magnesium alloy, an iron-based alloy, a copper alloy, a manganesealloy, and a Ni—Ti based alloy may be exemplified.

Hereinbefore, a description has been made in detail with respect to theconfiguration of the base 7.

According to this base 7, the supporting member 3 may be simply fixed,and the positioning of the supporting member 3 around the respectiveaxes of x-axis, y-axis, and z-axis with respect to the base 7 may besimply performed with high accuracy. Therefore, the module 1 that iscapable of exhibiting excellent detection accuracy may be obtained.

In addition, as described above, in the case of mounting the module 1 onan object, when the positioning of the module 1 around the z-axis withrespect to the object is performed with two side faces 7 c and 7 d ofthe base 7, which are orthogonal to each other, made as a reference, thedetection axes A2 and A3 of the angular velocity sensors 412 and 413 maybe made to face a desired direction in a simple manner. Specifically,the side face 7 c is a face parallel to the detection axis A3, and theside face 7 d is a face parallel to the detection axis A2. Therefore,when the positioning is performed with the side faces 7 c and 7 d madeas a reference, the detection axes A2 and A3 of the angular velocitysensors 412 and 413 may be made to face a desired direction in a simplemanner. In addition, the side faces 7 c and 7 d intersect each otherwhile the elongated holes 711 and 712 are not formed between the sidefaces 7 c and 7 d, such that when the positioning is performed with thevicinity of a connection portion between the side faces 7 c and 7 d madeas a reference, the above-described positioning may be performed in arelatively simple and accurate manner.

Cover Member

The cover member 10 is fixed to the base 7 so as to cover the supportingmember 3. According to this configuration, the electronic components 4may be protected. In addition, the cover member 10 has an opening 101formed in a side face thereof, and in a state in which the cover member10 is fixed to the base 7, the connector 49 is exposed from the opening101 to the outside. According to this configuration, electricalconnection between an external apparatus and the connector 49 may beeasily performed. The method of fixing the base 7 and the cover member10 is not particularly limited, and fitting, screwing, and bonding withadhesive may be used.

In addition, two corner portions of the cover member 10 are cut out soas not to overlap the elongated holes 711 and 712 formed in the base 7in xy plan view. Therefore, the fixing of the module 1 to the object(object) may be easily performed.

Although not particularly limited, as a constituent material of thecover member 10, for example, polyolefin such as polyethylene,polypropylene, and ethylene-propylene copolymer, polyester such aspolyvinyl chloride, polystyrene, polyamide, polyimide, polycarbonate,poly-(4-methyl pentene-1), ionomer, an acrylic resin, polymethylmethacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin),acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer,polyethylene terephthalate (PET), and polybutylene terephthalate (PBT),polyether, polyether ketone (PEK), polyether ether ketone (PEEK),polyether imide, polyacetal (POM), polyphenylene oxide, polysulfone,polyether sulfone, polyphenylene sulfide, polyarylate, aromaticpolyester (liquid crystal polymer), polytetrafluoroethylene,polyvinylidene fluoride, and in addition to these, a fluorine-basedresin, an epoxy resin, a phenol resin, a urea resin, a melamine resin, asilicone resin, polyurethane, or the like, or copolymers, blends,polymer alloys, and the like, which contain these as a main component,may be exemplified, and one kind or two or more kinds of these may becombined to be used.

Hereinbefore, a description has been made with respect to the casing 6.

In the module 1, a filler (molding material) (not shown) is filled inthe concave portion 72 of the base 7, and a gap between the concaveportion 72 and the first rigid substrate 21 is buried with the filler.The rear-side mounting face 212 (the angular velocity sensor 411 and theacceleration sensor 42) of the first rigid substrate 21 or theconnecting portions 261, 262, and 263 that extend from the first rigidsubstrate 21 are fixed with the filler 9, and therefore unnecessaryvibration is effectively prevented from occurring in the first rigidsubstrate 21. As a result, the detection accuracy of the angularvelocity sensors 411 to 413 or the acceleration sensor 42 may beimproved.

A material having an insulating property is preferable as a constituentmaterial of the filler. Although not particularly limited, as thismaterial, for example, polyolefin such as polyethylene, polypropylene,and ethylene-propylene copolymer, polyester such as polyvinyl chloride,polystyrene, polyamide, polyimide, polycarbonate, poly-(4-methylpentene-1), ionomer, an acrylic resin, polymethyl methacrylate,acrylonitrile-butadiene-styrene copolymer (ABS resin),acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer,polyethylene terephthalate (PET), and polybutylene terephthalate (PBT),polyether, polyether ketone (PEK), polyether ether ketone (PEEK),polyether imide, polyacetal (POM), polyphenylene oxide, polysulfone,polyether sulfone, polyphenylene sulfide, polyarylate, aromaticpolyester (liquid crystal polymer), polytetrafluoroethylene,polyvinylidene fluoride, and in addition to these, a fluorine-basedresin, an epoxy resin, a phenol resin, a urea resin, a melamine resin, asilicone resin, polyurethane, or the like, or copolymers, blends,polymer alloys, and the like, which contain these as a main component,may be exemplified, and one kind or two or more kinds of these may becombined to be used.

Second Embodiment

Next, a second embodiment of the module of the invention will bedescribed.

FIG. 10 shows a plan view illustrating a mounting substrate provided tothe module according to a second embodiment of the invention.

Hereinafter, the second embodiment will be mainly described based on adifference with the above-described embodiment, and description withrespect to substantially the same configuration as the above-describedembodiment will not be repeated.

The module according to the second embodiment of the invention issubstantially the same as the first embodiment except that aconfiguration of the mounting substrate is different in each case.

As shown in FIG. 10, a mounting substrate 2A includes a first rigidsubstrate 21, a second rigid substrate 22, a third rigid substrate 23, afourth rigid substrate 24, and a fifth rigid substrate 25 that aredisposed to be spaced from each other, and a flexible substrate 26A thatconnects these rigid substrates.

In addition, the flexible substrate 26A includes a first connectingportion 261 that connects the first rigid substrate 21 and the secondrigid substrate 22, a second connecting portion 262 that connects thefirst rigid substrate 21 and the third rigid substrate 23, a thirdconnecting portion 263A that connects the third rigid substrate 23 andthe fourth rigid substrate 24, and a fourth connecting portion 264 thatconnects the second rigid substrate 22 and the fifth rigid substrate 25.The first connecting portion 261, the second connecting portion 262, thethird connecting portion 263A, and the fourth connecting portion 264have flexibility, and therefore bending deformation in a face directionmay be easily performed.

Even in the mounting substrate 2 having this configuration, as describedin the first embodiment, the mounting substrate 2 may be deformed into arectangular parallelepiped shape in a manner such that the first rigidsubstrate 21 makes up the bottom face, the second rigid substrate 22makes up the top face, the third to fifth rigid substrates 23 to 25 makeup side faces, and rigid substrates adjacent to each other areorthogonal to each other.

According to this second embodiment, the same effect as the firstembodiment may be exhibited.

2. Electronic Apparatus

The above-described module 1 may be assembled into various electronicapparatus. Hereinafter, an electronic apparatus according to theinvention in which the module 1 is mounted will be described. FIG. 11shows a view illustrating an example of a configuration of an electronicapparatus 500 in which the module 1 is mounted. The electronic apparatus500 is not particularly limited, and for example, a digital stillcamera, a video camera, a car navigation system, a cellular phone, amobile PC, a robot, a gaming machine, a game controller, or the like maybe exemplified.

The electronic apparatus 500 shown in FIG. 11 includes a sensor module510 including the module 1, a processing unit 520, a memory 530, anoperation unit 540, and a display portion 550. These are connected toeach other by a bus 560. The processing unit (CPU, MPU, or the like) 520performs a control of the sensor module 510 or the like, or an entirecontrol of the electronic apparatus 500. In addition, the processingunit 520 performs processing on the basis of angular velocityinformation detected by the sensor module 510. For example, theprocessing unit 520 performs processing for camera shake correction, aposture control, GPS autonomous navigation, or the like on the basis ofthe angular velocity information. The memory 530 stores a controlprogram or various pieces of data, and functions as a work area or adata storage area. The operation unit 540 allows a user to operate theelectronic apparatus 500. The display unit 550 displays various kinds ofinformation to the user.

Above, a description has been made with respect to the module andelectronic apparatus according to the invention on the basis ofembodiments shown in the drawings, but the invention is not limitedthereto, and configurations of respective portions may be substitutedwith arbitrary configurations having substantially the same functions.

In addition, in the above-described embodiments, a description has beenmade with respect to a configuration in which three angular velocitysensors are mounted on the mounting substrate, but the number of theangular velocity sensors is not limited to this, and may be one or two.In addition, the number of the rigid substrates may be changed inresponse to the number of the angular velocity sensors.

In addition, in the above described embodiments, a description has beenmade with respect to a configuration in which the rigid and flexiblesubstrate is used as the mounting substrate, but a flexible substratemay also be used as the mounting substrate.

1-13. (canceled)
 14. A module comprising: a first substrate thatincludes a first sensor device; a second substrate that includes asecond sensor device; and a first connecting portion that connects thefirst substrate and the second substrate, and the first connectingportion being flexible, wherein the first substrate has a first cut-outportion, and the first connecting portion extends from the first cut-outportion.
 15. The module according to claim 14, wherein the firstsubstrate includes an electronic component which is electricallyconnected to the first sensor device and the second sensor device. 16.The module according to claim 14, further comprising: a third substratethat includes a third sensor device; and a second connecting portionthat connects the first substrate and the third substrate, and thesecond connecting portion being flexible, wherein the first substratehas a second cut-out portion, and the second connecting portion extendsfrom the second cut-out portion.
 17. The module according to claim 16,wherein the first substrate, the second substrate, and the thirdsubstrate are disposed to be orthogonal to each other.
 18. The moduleaccording to claim 16, wherein detection axes of the first sensordevice, the second sensor device, and the third sensor device areorthogonal to each other.
 19. The module according to claim 14, furthercomprising: a supporting member that has a plurality of fixing faces,wherein the first substrate and the second substrate are disposed alongthe fixing faces, respectively.
 20. The module according to claim 15,further comprising: a fourth substrate that includes a digital circuitwhich is electrically connected to the electronic component; and a thirdconnecting portion that connects the first substrate and the fourthsubstrate, and the third connecting portion being flexible, wherein thefirst substrate has a third cut-out portion, and the third connectingportion extends from the third cut-out portion, wherein the fourthsubstrate has a fourth cut-out portion, and the third connecting portionextends from the fourth cut-out portion.
 21. The module according toclaim 20, further comprising: a fifth substrate that includes aconnector for an interface; and a fourth connecting portion thatconnects the fourth substrate and the fifth substrate so as toelectrically connect the digital circuit and the connector.
 22. Themodule according to claim 20, wherein the electronic component includesat least one of a power supply circuit, an amplifying circuit, and ananalog/digital converting circuit, and the digital circuit includes amicrocontroller.
 23. An electronic apparatus comprising: the moduleaccording to claim 14.